High Density Interconnect Technology (HDI) for Chip Scale and Land Grid Array Packaging for Space Qualifiable Radiation Hardened Systems on a Chip Solutions
نویسندگان
چکیده
We use the GE High Density Interconnect(POL) Technology to create packages for 7x7mm and 3x3mm die in 90nm Radiation Hardened ASICs. We use HDI to “grow” the 7x7mm,3x3mm die to accommodate existing 1.27mm pitch LGA Packages. Next we create 16x16 and 10x10 BGAs with 0.8mm pitch for ultra small size, high acceleration, temperature cycling for
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